发明名称 PARTS FOR VACUUM FILM DEPOSITION APPARATUS AND VACUUM FILM DEPOSITION APPARATUS USING THE PARTS
摘要 PROBLEM TO BE SOLVED: To stably and effectively prevent separation of a film deposition material deposited during a film deposition step when depositing a thin film with high internal stress in a vacuum film deposition apparatus, and to suppress degradation of the productivity and increase in the film deposition cost when the apparatus is cleaned and parts are changed. SOLUTION: In the parts of the vacuum film deposition apparatus, a thin film formed of a single metal element selected from Ti, Zr, Hf, Nb, Ta, W, Ru, Pd, Ir, Pt, Ag, Au and In, or an alloy or a compound containing these metals is deposited. The part 1 of the apparatus comprises a component body 2, and a thermal sprayed film 3 deposited on the surface of the component body 2 and formed of a Cu alloy (containing 65-95 mass % Cu) containing at least one kind of the elements selected from Al, Ti, Zr, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ni, Pt, Ag, Zn and Sn. The Cu alloy thermal sprayed film 3 has the hardness of <=Hv 200 in Vickers hardness.
申请公布号 JP2002363728(A) 申请公布日期 2002.12.18
申请号 JP20010171465 申请日期 2001.06.06
申请人 TOSHIBA CORP;TOSHIBA ELECTRONIC ENGINEERING CORP 发明人 YABE YOICHIRO;SATO MICHIO;NAKAMURA TAKASHI;KOSAKA YASUO
分类号 C23C14/00;C23C4/08;C23C4/18;C23C16/44;C23C28/02;H01L21/285;(IPC1-7):C23C14/00 主分类号 C23C14/00
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