发明名称 ACTIVE ENERGY BEAM CURING TYPE CONDUCTIVE PASTE, PRODUCTION METHOD AND PRINTING DEVICE FOR A CIRCUIT SUBSTRATE AND A NON-CONTACT ID
摘要 <p>There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured with an electron beam having an acceleration voltage of 150 kV and an irradiated dose of 40 kGy, has an internal stress of 5 to 50 Mpa; a production method and a device for a conductor circuit substrate using the active energy beam curing type conductive paste; and a non-contact ID using the active energy beam curing type conductive paste and a production method for the ID. <IMAGE></p>
申请公布号 EP1267360(A1) 申请公布日期 2002.12.18
申请号 EP20010904570 申请日期 2001.02.20
申请人 TOYO INK MANUFACTURING CO. LTD.;TORAY ENGINEERING CO., LTD. 发明人 TSURUTA, H.;NAKAMURA, M.;AKITA, M.;ITO, KOJI;MORI, TOSHIHIRO
分类号 C08F2/46;G06K19/077;H05K1/09;(IPC1-7):H01B1/20;H05K3/12;G06K19/07 主分类号 C08F2/46
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