| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive which is curable under conditions of low temperature and short time and has high shelf life. SOLUTION: The adhesive has a silane coupling agent, an epoxy resin and a latent curing agent 30 in which curing agent particles 31 composed of a metal chelate are covered with a capsule 33. Since these curing agent particles 31 are covered with the capsule 33 at ordinary temperature, polymerization reaction of the epoxy resin does not occur, but when the adhesive is heated, the capsule 33 is broken and the metal chelate constituting the curing agent particles 31 reacts with the silane coupling agent to produce a cation, and the epoxy resin is polymerized by the cation (cation polymerization) to cure the adhesive. Since the reaction with which the cation is produced occurs at a lower temperature than a temperature at which conventional adhesive is thermally cured, the adhesive of the present invention is cured at a lower temperature and in a shorter time. As a result, the adhesive of the present invention is low- temperature curing type and has high shelf life.
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