CHIP SCALE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A CSP(Chip Scale Package) and a method for manufacturing the same are provided to enhance a bonding intensity of a metal wire and to simplify manufacturing processes. CONSTITUTION: Chip pads(202) are formed on a semiconductor chip(200). A first insulating layer(204) is formed on the semiconductor chip(200) and has an opening for exposing the chip pads. A metal wire(214) is electrically connected to the chip pad(202) by filling the opening. A second insulating layer(206) is formed on the first insulating layer(204) so as to expose the metal wire(214). A solder ball(218) is formed on the exposed metal wire(214) and mounted on a substrate(220). The second insulating layer(206) is an epoxy or a silicon rubber.