Semiconductor clamping device

摘要

The present invention relates to a clamping device for increasing the heat transfer between a semiconductor device and a heat dissipating device. The clamping device comprises a clamp having a pair of cooperating jaws. A resiliently biased pressure distribution member extends from one of the jaws. The pressure distribution member and the other jaw are adapted to hold a semiconductor device in contact with the heat dissipating device. A tie rod extends between the clamp jaws. A collar is provided having a central cavity for holding the semiconductor device within and aligning the semiconductor device with respect to the heat dissipating device and the clamp. The collar also has a channel for engaging the tie rod and aligning the collar such that the semiconductor device is aligned between the pressure distribution member and the opposite clamp jaw.