发明名称 |
METHOD FOR LAMINATION OF FLUOROPOLYMER TO METAL AND PRINTED CIRCUIT BOARD (PCB) SUBSTRATE |
摘要 |
<p>The present invention is directed to a method for the lamination of fluoropolymers to the surfaces of metals, and especially to copper, gold, and platinum, and to printed circuit board (PCB) substrate at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of metals in the presence of a functional monomer and an adhesive such as an epoxy resin. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The laminated fluoropolymer-metal or fluoropolymer-PCB substrate interfaces exhibit T-peel strengths of no less than 8 N/cm. This invention can also be applied to substantially improve the adhesion between PCB substrates and metals.</p> |
申请公布号 |
SG93210(A1) |
申请公布日期 |
2002.12.17 |
申请号 |
SG19990003216 |
申请日期 |
1999.06.29 |
申请人 |
NATIONAL UNIVERSITY OF SINGAPORE;INSTITUTE OF MICROELECTRONICS |
发明人 |
ZHANG JUNFENG;CUI CHENG QIANG;LIM THIAM BENG;KANG EN-TANG |
分类号 |
B32B7/12;B32B27/06;B32B38/16;C08J7/18;H05K3/38;(IPC1-7):H05K1/03;H05K1/05;B32B15/08 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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