发明名称 |
Method and device for mounting electronic component |
摘要 |
In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
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申请公布号 |
US6493931(B2) |
申请公布日期 |
2002.12.17 |
申请号 |
US20010810652 |
申请日期 |
2001.03.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HIRANO MASATO;SAKAI YOSHINORI;NAKASHIMA TATEO |
分类号 |
H05K13/04;H05K13/08;(IPC1-7):H05K3/30 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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