发明名称 Method and device for mounting electronic component
摘要 In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.
申请公布号 US6493931(B2) 申请公布日期 2002.12.17
申请号 US20010810652 申请日期 2001.03.15
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HIRANO MASATO;SAKAI YOSHINORI;NAKASHIMA TATEO
分类号 H05K13/04;H05K13/08;(IPC1-7):H05K3/30 主分类号 H05K13/04
代理机构 代理人
主权项
地址