发明名称 Method for improving the quality of a metal layer deposited from a plating bath
摘要 The present invention is related to a method for depositing a metal-containing film from a metal plating bath, comprising the steps of subsequently depositing a metal-containing layer from a metal plating bath followed by a heating step and/or a vacuum step, said subsequent steps being repeated for a number of times in different sequences.
申请公布号 US6495453(B1) 申请公布日期 2002.12.17
申请号 US20000599133 申请日期 2000.06.22
申请人 INTERUNIVERSITAIR MICROELECTRONICA CENTRUM 发明人 BRONGERSMA SYWERT H.;RICHARD EMMANUEL;VERVOORT IWAN;MAEX KAREN
分类号 H01L21/288;H01L21/768;(IPC1-7):H01L21/44 主分类号 H01L21/288
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