发明名称 SYSTEMS AND METHOD FOR COUPLING CONDUCTIVE PELLETS TO A COMPONENT OF AN INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To bond a conductive pellet to a part through one operation in one place by forming the pellet penetrating a ribbon, and shifting a punching machine relative to the part. SOLUTION: A system 10 for bonding a conductive pellet to a part 12 in an integrated circuit is shown in figure. The ribbon 1 may be formed of any material suitable for the formation of conductive pellets, and the pellet may be in any shape as long as it is suitable for bonding the part 12 to another mechanism of electronic equipment. The ribbon 14 is a virtually flat strip and formed of conductive material. The ribbon is so designed that when the reels 24 are turned in the direction of the arrows 26, the ribbon 14 is fed in the direction of the arrow 28. The ribbon 14 is unrolled virtually in parallel between the reels 24, and is positioned such that the ribbon can be moved between the first member 16 and the second member 18 of a punching machine 20 placed in the position 22. As a result, a conductive pellet can be bonded to the part 12.
申请公布号 SG93181(A1) 申请公布日期 2002.12.17
申请号 SG19970004418 申请日期 1997.12.12
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 JACK CHOU;JOHNNY CHENG;JOYCE HSU
分类号 B21D28/00;H01L21/60;H01L23/12;H01L23/48;H05K3/34;(IPC1-7):H01L21/60 主分类号 B21D28/00
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