发明名称 Variable time etching system according to the accumulated number of devices being processed and a method for etching in the same manner
摘要 An etching system and method. In the method, layers are etched on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, wherein an etching period varies according to an accumulated process number of substrates. The system includes an etching equipment including an etching processor for etching layers on a plurality of substrates using a single amount of etchant to form a predetermined pattern on each of the layers, and a loader for temporarily holding cassettes in which the substrates are stored; and a controller for controlling operations of the etching equipment. The etching equipment changes an etching period according to an accumulated process number of the substrates.
申请公布号 US6495055(B2) 申请公布日期 2002.12.17
申请号 US19990337735 申请日期 1999.06.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LIM JUNG-TAEK;BYUN SUNG-JOON;LEE SOO-WON;KIM JIN-SOO
分类号 H01L21/306;C23F1/00;C23F1/02;C23F1/08;G02F1/13;H01L21/00;H01L21/302;(IPC1-7):C03C25/068;C03C15/000 主分类号 H01L21/306
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