发明名称 Method for forming a nitridized interface on a semiconductor substrate
摘要 A surface treatment method for forming a fluorine-doped nitridized interface on a semiconductor substrate. The fluorine-doped nitridized interface may be formed using an ammonia plasma CVD process having a treatment gas doped with a fluorine component, such as carbon hexafluorine. The method may be employed as part of a LOCOS-based processing scheme in the manufacture of MOS semiconductor devices, such as DRAM devices.
申请公布号 US6495477(B2) 申请公布日期 2002.12.17
申请号 US20010862348 申请日期 2001.05.21
申请人 SAMSUNG AUSTIN SEMICONDUCTOR, LLC 发明人 TAYLOR JONATHAN J.;JENDRESKY DAVID F.
分类号 C23C16/34;C23C8/28;C23C8/36;C23C28/00;H01L21/314;H01L21/316;H01L21/318;H01L21/32;H01L21/321;H01L21/76;H01L21/762;(IPC1-7):H01L21/31;H01L21/469 主分类号 C23C16/34
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