发明名称 Circuit board assembly and method of fabricating same
摘要 A circuit board assembly and method of fabricating an assembly are provided. The assembly preferably comprises a first circuit board defining an aperture and a second circuit board having an edge. The first circuit board has at least one conductive feature proximate the aperture, and the second circuit board has at least one conductive feature proximate the edge. Each board has at least one circuit trace in electrical communication with its respective conductive feature. The conductive features of the boards are placed in electrical communication with each other by way of the edge of the second board being disposed in the aperture of the first board. A solder joint can be disposed on the assembly so as to connect the first and second boards.
申请公布号 US6496384(B1) 申请公布日期 2002.12.17
申请号 US20010957782 申请日期 2001.09.21
申请人 VISTEON GLOBAL TECHNOLOGIES, INC. 发明人 MORALES JORGE;AVITIA CESAR
分类号 H05K3/36;H05K3/40;(IPC1-7):H05K3/36 主分类号 H05K3/36
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