| 摘要 |
There is described a three-dimensional electronic device (9) having a number of integrated electronic circuits (1) stacked and forming respective gaps in which are deposited an absorbent material (10) and a liquid impregnating the absorbent material (10). The integrated electronic circuits (1) are enclosed in a hermetic package (7); and, during operation of the electronic device (9), the heat produced by the integrated electronic circuits (1) causes the liquid to evaporate, the vapor comes into contact with, and transfers heat to, the walls of the package (7), and, on cooling, condenses once more to the liquid state, which, by virtue of the capillarity of the absorvent material (10), is brought once more into contact with the integrated electronic circuits (1). |
