| 摘要 |
PURPOSE: A probe card for testing a semiconductor device is provided to form a guide hole for preventing a needle from moving by a wafer fabrication process, to thereby allowing a high integrated semiconductor device to be tested by drastically scaling down a thickness and a length of needle by using a wafer fabrication process. CONSTITUTION: A probe card for testing a semiconductor device includes a main substrate(10) printed thereon a plurality of circuits and formed thereon a plurality of pin holes, a reinforce plate(20) formed at a center portion of a top surface thereof for preventing the main substrate(10) from distorting, a mount block(30) provided with an insertion hole penetrating downward at a center portion thereof, a bottom cover plate(40) attached at a bottom portion of the mount block(30), a needle(50), a guide block(60) attached to a top surface of the bottom cover plate(40) at a predetermined distance for preventing the needle(50) from moving up and down, a guide plate(70) attached to a top surface of the guide block(60) at a preset distance for preventing a portion of the needle(50) vertically protruding upward from moving laterally, a sub-substrate(80) attached to a top portion of the guide plate(70) for forming a connecting hole for inserting the upward protrusion of the needle(50) and forming a circuit pattern from the connecting hole and an interface rubber(90) fixed between the sub-substrate(80) and the main substrate(10) with protruding a plurality of terminals upward in such a way that a top portion thereof is connected to the terminal placed at the main substrate(10).
|
