| 摘要 |
The fixing is provided by a spring retaining clip (8), used to secure the component (4) to a profiled carrier rail (1), which acts simultaneously as a heat sink for the waste heat generated by the component. The clip is fitted in a reception slot (7) provided by the rail at one or both ends and presses the rear surface of the component in the direction of a side surface of the rail, extending perpendicular to the surface of the circuit board (3) on which the component is mounted. |
