LEAD FRAME, AND SEMICONDUCTOR DEVICE USING IT, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a lead frame which sharply reduces the manufacture cost and enhances the mounting rate on a board, and a semiconductor device using it, and to provide its mounting method. SOLUTION: This lead frame has bases whose bottoms are roughly in one plane and islands and electrodes which are integrally connected partially with the tops of such bases.