| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat conductive substrate, which can reliably position a land, which is a part needing an electrically independent insulation, and can prevent a contamination due to a thermosetting resin composition from being generated. SOLUTION: A heat conductive substrate is constituted in a structure that a terminal plate and a circuit formation part are formed on a conductive metal plate 11 with a pattern of a resist 14 and after that, the circuit formation part is masked 16 to apply a solder plating 15 to the circuit formation part and after the masking 16 is removed, a pattern work of a joint 17 connecting a part needing an electrically independent insulation and the circuit formation part is performed and after a film 18 is pasted on the printing surface of the resist 14, the joint 17 is removed by punching along with the film 18 to form a lead frame 12, a thermosetting resin composition 21 and a metal plate 23 for heat dissipation are stacked on the circuit formation part on a lead frame 12 and the composition 21 and the metal plate 23 are heated and pressed to cure the composition 21 and the metal plate 23. |
