| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly integrated multilayered wiring board having fine bumps. SOLUTION: A method of manufacturing multilayered wiring board includes at least a laminating step. In the step, a plurality of multilayered metal sheets 1 each of which is composed of a bump-forming metal layer 2, an etch stop layer 3, and a wiring film forming metal layer 4 is prepared and wiring films 4a and bumps 2a are respectively formed of the metal layers 4 and 2 in the metal plates 1. Then two 1a and 1b of the prepared metal sheets 1 are laminated upon another by sticking an insulation layer 5 to the bump forming surface of the metal plate 1a and connecting the wiring films 4a of the metal plate 1b to the bumps 2a of the metal plate 1a. After lamination, another multilayered metal plate 1c is laminated upon the metal plate 1b by sticking an insulation layer 5 to the bump forming surface of the metal plate 1b and connecting the wiring films 4a of the plate 1c to the bumps 2a of the metal plate 1b. |
