发明名称 MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a means whereby the generation of the warpage of a ceramic laminated electronic component is made hard irrespective of multilayer and thinning of a ceramic green sheet, in the manufacture of such a ceramic laminated electronic component as a ceramic laminated capacitor wherein the increase of its capacity and the decreases of its size and thickness are required, and to improve the quality of the electronic component and reduce the cost thereof. SOLUTION: By so creating the intermediate products of first and second laminated blocks 10, 20 (laminated green blocks) independently of each other as to be laminated, there are reduced the unevennesses (unbalances) of the filling densities, etc., of the respective blocks 10, 20 which are caused by the process hysteresises of their laminated hierarchies (the times of pressing them, etc.). By so bonding pressingly to each other the surfaces of the opposite-side laminated portions of the first and second laminated blocks to their respective base portions as to be integrated with each other, the unbalances of the physical properties (filling densities, etc.), of the first and second laminated blocks which tend to become the causes of the warpage, etc., of a final product are cancelled to some extent, and this fact makes hard the generations of the warpage, etc., of the final product.
申请公布号 JP2002359142(A) 申请公布日期 2002.12.13
申请号 JP20010165937 申请日期 2001.05.31
申请人 NGK SPARK PLUG CO LTD 发明人 ITO JUNICHI;OTSUKA ATSUSHI;SATO MOTOHIKO;SATO MANABU
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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