| 摘要 |
PROBLEM TO BE SOLVED: To prevent deterioration in polishing performance, by utilizing self-generating action. SOLUTION: The machine includes a first-axis grinding wheel 15 for grinding a wafer to a coarse finish level in a first chuck table 12, a second-axis grinding wheel 17 for grinding the wafer of a second chuck table 13 to a fine finish level, first and second cassette stages 18 and 20 having cassettes 19 and 21 installed for accommodating plural normal and reproduction wafers Wa and Wb therein respectively, a transfer robot 23 for transferring the wafer, and a controller 24 for controlling the wheels, stages and robot. The controller 24 alternately supplies the normal and reproduction wafers Wa and Wb to the second chuck table 13 to accurate-finish grind the wafers by the second-axis grinding wheel 17. Upon accurate-finish grinding by the second-axis wheel the usual wafer coarse-finish ground by the first-axis wheel, since the second-axis wheel is made autogenous by the normal wafer, the second-axis wheel can be prevented from becoming clogged and reduced in its grinding performance, so that proper accurate-finish grinding can always be secured. |
