发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for improving the performance level of the device by improving operating characteristics and reliability of a TFT formed by using a polycrystalline semiconductor film. SOLUTION: The method for manufacturing the semiconductor device comprises a first step of forming a first semiconductor film having an amorphous structure on an insulating surface, a second step of forming a first semiconductor film having a crystal structure and an oxide film on the first film by irradiating the first semiconductor films which has amorphous structure with a laser beam and crystallizing the first film, a third step of removing the oxide film, a fourth step of planarizing the surface of the first semiconductor film by irradiating with the beam in an inert gas atmosphere or in vacuum, a fifth step of forming a second semiconductor film having an amorphous structure on the first film having the crystal structure, and a sixth step of forming a second semiconductor film which has a crystal structure by irradiating the second film side, having the amorphous structure with the beam and crystallizing the second film.</p>
申请公布号 JP2002359251(A) 申请公布日期 2002.12.13
申请号 JP20010165950 申请日期 2001.05.31
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 ARAI YASUYUKI;MIYAIRI HIDEKAZU
分类号 G02F1/1368;G09F9/30;H01L21/20;H01L21/336;H01L27/08;H01L29/786;(IPC1-7):H01L21/336;G02F1/136 主分类号 G02F1/1368
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