| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a piezoelectric oscillator, which can prevent peeling or chipping of an electrode, when uniting a piezoelectric mother board 100 and a capacitor mother board 200 by a binder and cutting them separately for each piezoelectric oscillator. SOLUTION: A manufacturing method is provided, which dices a jointed body, formed by uniting the piezoelectric mother board 100 and the capacitor mother board 200 by a binder and filling wax between them and hardening them and removes the wax 8. |
