| 摘要 |
PROBLEM TO BE SOLVED: To provide a high sensitivity positive type photosensitive resin capable of giving a pattern with high resolution and a high rate of a residual film and having superior mechanical characteristics, adhesiveness and water absorbing property as film characteristics after curing. SOLUTION: The positive type photosensitive composition comprises 100 pts.wt. alkali-soluble resin (A), 1-100 pts.wt. photosensitive diazoquinone compound (B), a filler (C) whose content F is 2-70 wt.% and 1-40 pts.wt. organosilicon compound (D) or further contains a phenol compound. |
