| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit mounting method, capable of improving integrated circuits in density of mounting and heat dissipation effects. SOLUTION: A flexible wiring board 3 is equipped with a copper plate 2, which is 0.1 to 0.3 mm in thickness and provided inside. The whole surface of the wiring board 3 is partitioned into a fixed part 11, a mounting part 21, a folded part 31, a mounting part 22, a fixed part 12, a mounting part 23, a folded part 32, a mounting part 24, and a fixed part 13. The flexible wiring board 3 and the copper plate 2 are formed and folded to meander, so as to make the adjacent parts normal with respect to each other. The fixed parts 11, 12, and 13 of the flexible wiring board 3 are fixed to a wiring board 5, and the integrated circuits 1 are mounted three-dimensionally on each side of the mounting parts 21 to 24. The folded parts 31 and 32 are fixed to a heat dissipating plate 4. |
