EXPOSURE PROCESS MANAGING SYSTEM, METHOD THEREFOR AND PROGRAM FOR MANAGING EXPOSURE PROCESS

摘要

PROBLEM TO BE SOLVED: To manage overlay accuracy in an exposure process for manufacturing a semiconductor while considering changes with time. SOLUTION: In an exposure process, a prescribed pattern is exposed on a piece of wafer using a first aligner and a second aligner. Deviation is generated on the pattern exposed on the piece of wafer. An exposure process managing apparatus includes an inspection data storing section 32 for storing date and time when exposure process is executed and deviation amount, and an accuracy fluctuation detecting section 22 for determining whether or not a dispersion value of the deviation amount of a wafer processed during a first period is equal to a dispersion value of the deviation amount of a wafer processed during a second period, and allowing a display section 40 to display the fluctuation in the deviation amount when the deviation amounts are not equal.