| 发明名称 |
COPPER POWDER FOR LOW TEMPERATURE BURNING OR COPPER POWDER FOR ELECTROCONDUCTIVE PASTE |
| 摘要 |
PROBLEM TO BE SOLVED: To reduce the sintering starting temperature of electroconductive paste in the formation of an electroconductive circuit using copper powder as an electroconductive filler. SOLUTION: The whole surfaces of particles of the copper powder are coated with a thin film of copper oxide of 1.0 to 50 wt.% to the weight of the copper powder.
|
| 申请公布号 |
JP2002356702(A) |
申请公布日期 |
2002.12.13 |
| 申请号 |
JP20010162156 |
申请日期 |
2001.05.30 |
| 申请人 |
DOWA MINING CO LTD |
发明人 |
OKADA YOSHIHIRO;MIYOSHI HIROMASA;SANO KAZUJI |
| 分类号 |
B22F1/02;B22F1/00;H01B1/00;H01B1/22;(IPC1-7):B22F1/02 |
主分类号 |
B22F1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
