| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a small-sized laminated ceramic package incorporating a high-accuracy high-frequency circuit. SOLUTION: A method of manufacturing a laminated ceramic package with cavities is used as a method of manufacturing a laminated ceramic package 1. In the method of manufacturing the laminated ceramic package with the cavities, via holes 25 to 27, working as via hole electrodes are provided in green sheets 22 to 24 to form the via hole electrodes 9, 12 and 16. After that, cavity holes 15 15 and 19 used as the cavities are formed in the green sheets 23 and 24. Then pattern electrodes 7, 10, 13 and 17 are printed on the green sheets 21 to 24, and after that, a plurality of these green sheets 21 to 24 are laminated.</p> |
