| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device where the length of wiring is shortened without complicating the manufacture process. SOLUTION: A semiconductor chip 1 is arranged on the surface of a substrate 2. A case 11 is attached to the board 2 such that it surrounds the semiconductor chip 1. A base member 12 is made integrally with the case 11 such that it bridges the inner region of the case 11. An electrode 13 is made integrally with the base member 12 when the case 11 and the base member 12 are made. When the case 11 is fixed on the board 2, the base member 12 is arranged above the region where the semiconductor chip 1 is provided. The electrode 13 is electrically connected with one or plural semiconductor chips 1.</p> |
