RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent a resin-sealed semiconductor device to be corrosively deteriorated or the like due to a metal ion in an invaded water. SOLUTION: An anion exchange resin for capturing an anion and a cation exchange resin for capturing a cation are uniformly dispersed in a surface protective film 103 of a mesa type chip 17. Particularly, the anion exchange resin is blended in a double amount as large as the cation exchange resin, and controlled to a pH of 8 to 10.