| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a photocoupler that is constituted to prevent a transluscent resin from entering into the hole of a substrate and to provide a method of manufacturing the photocoupler. SOLUTION: A buffer pattern 14 is formed in advance in the periphery of each hole 11a on the surface of a substrate 11. At the time of performing primary molding, the transluscent resin is prevented from entering into each hole 11a by surely blocking the hole 11a by press-contacting the projecting section 31a of a top force with the buffer pattern 14 in the periphery of each hole 11a on the surface of the substrate 11.</p> |
