发明名称 MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To achieve improvement of quality and reduce a cost by providing a method which hardly generates warp even if a ceramic green sheet is made multilayered and thinned in manufacturing of a ceramic laminated electronic component such as a laminated ceramic capacitor which requires high capacity, compactness and thinning. SOLUTION: Irregularity of charging density or the like caused by a process history (the number of pressurization, for example) of a lamination hierarchy in each of block bodies 10, 20 is reduced by producing an intermediate item by laminating a first lamination block body (lamination green block body) 10 and a second lamination block body (lamination green block body) 20 separately. The first and second lamination block bodies are pressurized mutually in a lamination part surface in opposition to each base part. As a result, density difference or the like of each lamination hierarchy of a laminating body become easily off-set practically, and warp is hardly generated in a final product.
申请公布号 JP2002359139(A) 申请公布日期 2002.12.13
申请号 JP20010165818 申请日期 2001.05.31
申请人 NGK SPARK PLUG CO LTD 发明人 ITO JUNICHI;OTSUKA ATSUSHI;SATO MOTOHIKO;SATO MANABU
分类号 H01G4/12;H01F41/04;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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