MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To solve the problem that an insulation substrate can not be jointed since strain of a laminating body increases each time of baking of a laminated electronic component, which is repeatedly baked until it is completed. SOLUTION: A first coil is formed on a first insulation substrate. A second coil is formed on a second insulation substrate. The first coil and the second coil are joined opposite mutually via an insulator layer.