TEST METHOD OF SEMICONDUCTOR IC AND IC SOCKET

摘要

PROBLEM TO BE SOLVED: To prevent the adhesion of a foreign matter such as solder to a contact pin making contact with an IC lead in the final test of an IC. SOLUTION: The contact pin 12 of an IC socket 11 comprises two or more acute-angle irregular grooves 12a parallel to the wiping direction of the IC lead 13 with the contact pin 12 in the tip flat part making contact with the IC lead 13.