发明名称 MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a means whereby the generation of the warpage of a ceramic laminated electronic component is made hard irrespective of multilayer and thinning of a ceramic green sheet, in the manufacture of such a ceramic laminated electronic component as a ceramic laminated capacitor wherein the increase of its capacity and the decreases of its size and thickness are required. SOLUTION: By so creating first and second laminated blocks 10, 20 (laminated green blocks) independently of each other as to be laminated, there are reduced the unevennesses (unbalances) of the filling densities, etc., of the respective blocks 10, 20 which are caused by the process hysteresises of their laminated hierarchies (the times of pressing them, etc.). By coupling to each other the first and second laminated blocks, the density differences, etc., present in the respective laminated hierarchies of the obtained laminated bodies are made small, and the density differences are so cancelled substantially as to make hard the generations of the warpage, etc., of a final product.
申请公布号 JP2002359144(A) 申请公布日期 2002.12.13
申请号 JP20010165946 申请日期 2001.05.31
申请人 NGK SPARK PLUG CO LTD 发明人 ITO JUNICHI;OTSUKA ATSUSHI;SATO MOTOHIKO;SATO MANABU
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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