发明名称 THERMOPLASTIC RESIN COMPOSITION AND MOLDING THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition having excellent moldability and capable of producing moldings excellent in the balance between tensile elongation and strength at break, and suitable for electric cable sheath or coating. SOLUTION: This thermoplastic resin composition comprises 25 to 50 wt.% of (A) random interpolymer e.g. an ethylene-styrene copolymer comprising 1 to 99 mol% of a polymer unit derived from an aromatic vinyl- or vinylidene- monomer and/or a hindered aliphatic or alicyclic vinyl- or vinylidene-monomer, and 1 to 99 mol% of a polymer unit derived from at least anα-olefin having 2-20 carbon atoms, and 50 to 75 wt.% of (B) magnesium hydroxide having 0.5 to 2μm average particle size. The interpolymer (A) may be grafted by silane.
申请公布号 JP2002356590(A) 申请公布日期 2002.12.13
申请号 JP20010341910 申请日期 2001.11.07
申请人 MITSUI CHEMICALS INC 发明人 KIMURA TOMOHIKO;MORIYA SATORU
分类号 C08J5/00;C08K3/22;C08L23/08;C08L25/08;H01B3/00;H01B3/44;H01B7/17;(IPC1-7):C08L23/08 主分类号 C08J5/00
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