| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing wiring board, which is equipped with wiring and electrodes that are arranged on both its main surfaces and surely connected together via a through-hole, and improved in reliability without making the manufacturing process complicated and increasing the cost. SOLUTION: A film 10 is formed on one main surface (front surface) of a board 1 provided with a through-hole 4, then metal thin films 11 and 11a are each formed inside the through-hole 5 and the other main surface (rear surface) of the board 1, where the film 10 is not formed; and then the film 10 is removed, by which the metal thin film 11a (conduction electrode) of smooth surface is exposed to the other surface (rear surface). Then, a conductor pattern 12 is formed on the front surface of the board 1, and the conductor pattern 12 formed on the front surface of the board and the metal thin film 11 formed on the rear surface of the board 1 are surely made conductive via the metal thin film (conduction electrode) exposed on the surface of the board 1 via the through-hole 4.
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