| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to effectively prevent the generation of the junction breakage between a multilayer film and a sealing compound due to a thermal stress in a package for image pickup housing. SOLUTION: A package for image pickup element housing is formed in a structure that the package consists of an insulating base body 1 having a recessed part 1a with an image pickup element 4 mounted on its upper surface and a light-transmitting cover body 2 bonded to the upper surface of this base body 1 via a sealing compound 3 in such a way as to cover the recessed part 1a and this cover body 2 is formed of a light-transmitting plate material 2a and a multilayer film 2d formed by alternately stacking in order a plurality of low-refractive index thin film layers 2b, which are covered extending from the site opposing to the recessed part 1a under the lower surface of this plate material 2a to a region sealed with the sealing compound 3 and consist of an insulating material of a refractive index lower than 1.6, and a plurality of high-refractive index thin film layers 2c consisting of an insulating material of a refractive index higher than 1.7. In the package, with the side surfaces of the film 2d and the end parts of the surface of the film 2d covered with the sealing compound 3, the film 2d has 200 to 300-nm deep recessed parts A on its side surfaces.
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