| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component material which contains repellent chemicals, capable of coping with severe soldering mounting conditions and an electronic component, such as a printed board using the same and having repellent effects for a long term. SOLUTION: Electronic component material is used for forming an electronic component requiring soldering process. The electronic component material which contains at least curing resin, a filler, and a repellent having a vapor pressure of below 10,000 nPa is provided, and an electronic component such as a printed wiring board or the like where a film made of the material is formed at a prescribed position is provided.
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