CONTACT PROBE AND IC SOCKET

摘要

PROBLEM TO BE SOLVED: To make precise inspection at all times by suppressing damage of spherical bumps and production of solder chips even if an IC package is loaded in a displaced manner. SOLUTION: This contact probe is provided with a contact part press- contacting with the spherical bumps disposed in a grid shape in the bottom of the IC package. This contact probe is so formed that the contact part has multiple pointed projections projecting from the end part of the probe so that the spherical bump is seated inside the respective projections and the tips of the respective projections have blunt shaped by being chamfered.