| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure in which a module for a semiconductor device is realized in thinned and minimum area and to provide a method for manufacturing the same. SOLUTION: The semiconductor device comprises a semiconductor element and a terminal connected to the element. The device further comprises a first wiring connected to the element, and a second embedding wiring disposed oppositely to the first wiring in a state in which the element is sandwiched together with the first wiring between the first wiring and the second wiring. In this case, at least the first wiring of the first and second wirings is the embedding wiring obtained by removing a substrate after forming a wiring pattern on the substrate. In the device, the terminals are provided on front and rear surfaces of the device.
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