摘要 |
PROBLEM TO BE SOLVED: To enable a mounting component to be mounted at a certain position, when the mounting component is mounted directly on the surface of a board by the use of cream solder. SOLUTION: A cream solder 12 is applied on the surface of a board 1 at a mounting site 11, a concave-shaped groove 24 is provided to the mounting surface 22 of a mounting part 2 through an end 23 facing a soldering surface 22, the mounting part 2 is placed on the board 1, so as to make the cream solder 12 reach the concave-shaped groove 24, and then soldering operation is carried out.
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