| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device whose mounting area is narrow, without necessity of soldering a shield case to a grounding section on a printed board. SOLUTION: In the case of mounting the semiconductor device 11 on the printed board, each terminal pin 14a, 14b and 14c is inserted into each hole of the printed board so as to let the semiconductor device 11 stand by itself. In this condition, each terminal pin 14a, 14b and 14c is soldered to each wiring pattern of the printed board. The terminal pin 14c is connected to the grounding section of the circuit consisting of an optical element 12, an IC for signal processing, etc., and is connected to the wiring pattern at ground potential of the printed board. At this time, the projection 13b of the shield case 13 is connected to the wiring pattern at ground potential together with the terminal pin 14c.
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