Semiconductor wafer polishing device, has chemical/mechanical polishing device with polishing head

摘要

A device for polishing a wafer, has a retaining part on which is mounted a polishing cushion (112), and a polishing head (120) comprised of a carrier and a membrane, in which the polishing head is positioned on the polishing cushion (112) of the holder, the latter comprising a holder, a clamping ring for clamping the wafer by vacuum or reduced pressure, and a device for forwards and backwards movements of the clamping ring. An Independent claim is given for a method of polishing a wafer.