发明名称 |
Method and apparatus providing redundancy for fabricating highly reliable memory modules |
摘要 |
A method and apparatus for repair of a multi-chip module, such as a memory module, is provided, where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.
|
申请公布号 |
US2002185731(A1) |
申请公布日期 |
2002.12.12 |
申请号 |
US20020213185 |
申请日期 |
2002.08.05 |
申请人 |
AKRAM SALMAN;WARK JAMES M.;HEMBREE DAVID R. |
发明人 |
AKRAM SALMAN;WARK JAMES M.;HEMBREE DAVID R. |
分类号 |
H01L23/538;H05K1/00;H05K3/22;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/538 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|