| 摘要 |
<p>A multilayer wiring board (6) manufactured at low cost comprises an insulating sheet(1) having a through hole (100) and a thin-film wiring layer (2) formed on the insulating sheet. The board has a high reliability, and a high-density wiring can be provided on the board. A through hole is made in a glass sheet (1) by sand blasting, a wiring pattern (120) and an interlayer insulating layer (110) are formed on the glass sheet, and the through hole is filled with a plating wiring or a conductive material (101), thus fabricating a multilayer wiring board.</p> |
