| 摘要 |
In a method of forming a patterned thin film, a first film to be patterned and a peelable film are sequentially formed on a base layer, and an undercut mask is then formed thereon. Then, using of the mask, the peelable film and the first film to be patterned are etched selectively to form a first patterned thin film. During the etching, a substance that forms the first film to be patterned deposits to form a deposition film on the peelable film. Then, a film to be patterned is formed over the entire surface. During the formation, a substance that forms the film to be patterned deposits to form another deposition film on the peelable film. The mask and the peelable film are then peeled off to remove the deposition films together.
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