| 摘要 |
Lead-over-chip leadframes for coupling chip bond pads to the pins of a memory package contain a first plurality of short leads for coupling data chip bond pads to data pins on a first side of the memory package; a first plurality of long leads for coupling data chip bond pads to data pins on a second side of the memory package; a second plurality of short leads for coupling address chip bond pads to address pins on the second side of the memory package; and a second plurality of long leads for coupling address chip bond pads to address pins on the first side of the memory package.
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