| 摘要 |
PURPOSE: A semiconductor package stack system is provided to improve operation efficiency by unifying an inputting direction of a package and an adhesive, and an outputting direction of a stacked package. CONSTITUTION: The first to the six circulation hole(102-110) are formed in a predetermined interval on a work table. The second robot arm(132) is installed at an upper portion of the first and the second circulation hole(102,104). The third robot arm(134) is installed at an upper portion of the second and the third circulation hole(104,106). The first robot arm(130) is installed at an upper portion of the fifth and the sixth circulation hole(110,112). The first to the third robot arm(130,132,134) are used for transferring 16 packages or adhesives by using a vacuum method. In addition, the first to the third robot arm(130,132,134) have a photographing device such as a 3D vision or a laser beam scanner, respectively. An adhesive aligner(114) and an upper package aligner(116) are installed at rear parts of the first and the second circulation hole(102,104). A lower package aligner(118) is installed at rear parts of the fifth and the sixth circulation hole(110,112). The first to the fourth nest picture(120,122,126,128) are arranged on rear parts of each aligner(114,116,118). A package adhesion portion(124) is installed between the second and the third nest picture(122,126).
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