DRAM device and method of manufacturing the same

摘要

A method of manufacturing a DRAM device comprises forming a bit line interlayer insulating layer over a substrate over which a bit line pattern is formed; planarizing the bit line interlayer insulating layer; forming enlarged grooves exposing a conductive layer of the bit line pattern; forming bit lines; forming a silicon nitride layer over the substrate; forming a silicon nitride pattern having silicon nitride spacers formed on side walls of the enlarged grooves positioned on the conductive layer; forming the bit lines at the enlarged width portions of the bit line pattern; forming storage node contacts, storage nodes, a dielectric layer, and plate electrodes at a cell area; forming a wiring interlayer insulating layer on the substrate; forming metal contact holes; and forming plugs filling the metal contact holes.