发明名称 Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film
摘要 A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/mum2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.
申请公布号 US2002187895(A1) 申请公布日期 2002.12.12
申请号 US20020120393 申请日期 2002.04.12
申请人 OSAKA MUNICIPAL GOVERNMENT, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 IZAKI MASANOBU;HATASE HIROSHI;SAIJO YOSHIKAZU
分类号 C23C18/16;(IPC1-7):B01J23/58 主分类号 C23C18/16
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