发明名称 |
Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film |
摘要 |
A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/mum2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.
|
申请公布号 |
US2002187895(A1) |
申请公布日期 |
2002.12.12 |
申请号 |
US20020120393 |
申请日期 |
2002.04.12 |
申请人 |
OSAKA MUNICIPAL GOVERNMENT, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
IZAKI MASANOBU;HATASE HIROSHI;SAIJO YOSHIKAZU |
分类号 |
C23C18/16;(IPC1-7):B01J23/58 |
主分类号 |
C23C18/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|